| 发明名称 |
ASSEMBLAGE OF RADIOFREQUENCY CHIPS |
| 摘要 |
The method relates to production of a set of chips mechanically interconnected by means of a flexible connection. The chips, integrated on a substrate, each comprise a receiving area. The chips of the set are connected in series in the receiving areas by a connecting element. The chips are then released, the connecting element forming a flexible connection. |
| 申请公布号 |
EP2158604(A2) |
申请公布日期 |
2010.03.03 |
| 申请号 |
EP20080806014 |
申请日期 |
2008.06.18 |
| 申请人 |
COMMISSARIAT A L'ENERGIE ATOMIQUE |
发明人 |
VICARD, DOMINIQUE;BRUN, JEAN;LEPINE, BENOIT |
| 分类号 |
G06K19/077;D02G3/44;H01L21/683;H01L21/98;H01L23/00;H01L23/538;H01L25/00;H01L25/065;H01Q1/22 |
主分类号 |
G06K19/077 |
| 代理机构 |
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代理人 |
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| 主权项 |
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