发明名称 Manufacturing method for a semiconductor device
摘要 To provide a semiconductor device in which a layer to be peeled is attached to a base having a curved surface, and a method of manufacturing the same, and more particularly, a display having a curved surface, and more specifically a light-emitting device having a light emitting element attached to a base with a curved surface. A layer to be peeled, which contains a light emitting element furnished to a substrate using a laminate of a first material layer which is a metallic layer or nitride layer, and a second material layer which is an oxide layer, is transferred onto a film, and then the film and the layer to be peeled are curved, to thereby produce a display having a curved surface.
申请公布号 KR100944887(B1) 申请公布日期 2010.03.03
申请号 KR20020074787 申请日期 2002.11.28
申请人 发明人
分类号 H01L23/50;H01L21/762;H01L27/32 主分类号 H01L23/50
代理机构 代理人
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