发明名称
摘要 <P>PROBLEM TO BE SOLVED: To provide an acceleration sensor having a simple structure and not causing any strain on a substrate. <P>SOLUTION: This sensor is equipped with the quadrangular insulating substrate 12 such as a glass plate, and a semiconductor body part 22 such as a silicon wafer having the approximately same shape as the insulating substrate 12, having a hollow part 25 and equipped with a deadweight 26 in the center. An excision part 24 formed by excising a part of an approximately center part is formed on each side of the body part 22 relative to four sides. An extraction electrode 20 on the insulating substrate 12 is exposed from each excision part 24 in the state where the body part 22 is joined to the insulating substrate 12. The inside angle of the excision part 24 may be formed to have a beveled or rounded shape. <P>COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP4426202(B2) 申请公布日期 2010.03.03
申请号 JP20030103120 申请日期 2003.04.07
申请人 发明人
分类号 G01P15/125;G01P15/18;H01L29/84 主分类号 G01P15/125
代理机构 代理人
主权项
地址