| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a multiple patterning wiring board in which, even if a lid is joined in block to a conductor for sealing of each of a plurality of wiring board regions and cut, the lid is certainly joined to the conductor for sealing and which can form an electronic apparatus excellent in hermeticity with good productivity. <P>SOLUTION: The multiple patterning wiring board includes a mother substrate 1 in which a plurality of wiring board regions 2 are arranged and formed laterally and longitudinally on a main surface, the conductor 3 formed in the peripheral part of each wiring board region 2 over all periphery to seal for bonding and sealing the lid 6, a dummy region 4 formed in the exterior of the plurality of wiring board regions 2 of the main surface of the mother substrate 1, a conductor 5 for auxiliarily sealing formed along the border of the wiring board region 2 and the dummy region 4 so that the plurality of wiring board regions 2 are entirely surrounded in the dummy region 4, the lid 6 in which the lower surface is bonded to the conductor 3 for sealing and the conductor 5 for auxiliary sealing so that the plurality of wiring board regions 2 and the conductor 3 for the auxiliary sealing are entirely covered, and a plurality of grooves 6a formed in the longitudinal direction and the lateral direction in at least one of the upper surface and the lower surface of the lid 6. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
