| 摘要 |
PROBLEM TO BE SOLVED: To protect a resin-sealed semiconductor device against the adverse effect of a resin burr. SOLUTION: This resin sealing equipment comprises a plunger 1 for pressure injecting resin, a molding die 4 provided with a pot 2 through which the plunger advances and retracts, and a molding die 3 matched with the molding die 4. A groove 101 is formed in the forward end of the plunger 1 over the entire circumference thereof and a tapered part 102 is formed on the side face closer to the forward end of the groove 101. COPYRIGHT: (C)2004,JPO |
