| 摘要 |
<p>The invention relates to a heat-meltable pressure-sensitive adhesive (HMPSA) composition that comprises: a) 25 to 50 % of a mixture of styrene block copolymers of the SBS and SB types; b) 45 to 75 % of compatible tackifying resins having a softening temperature of between 80 and 150° C; c) 0.5 to 5.5 % of fatty acids in which the hydrocarbon chain contains from 10 to 22 carbon atoms. The invention also relates to a multi-layered system including an HMPSA layer, a printable substrate layer and an adjacent protection layer. The invention also relates to a corresponding pressure-sensitive adhesive label and to a method for recycling a labelled article that comprises removing said label by immersing the article in a hot basic aqueous solution.</p> |
