发明名称 |
Component-embedded substrate and component package using component-embedded substrate |
摘要 |
A component-embedded substrate includes a chip capacitor. The chip capacitor includes a ceramic laminate body and a plurality of terminal electrodes. The component-embedded substrate has a first principal surface and a second principal surface. At least two of the plurality of terminal electrodes are connected to the first principal surface and define a first terminal electrode group, and at least two of the plurality of terminal electrodes are connected to the second principal surface and define a second terminal electrode group. One terminal electrode in the first terminal electrode group is electrically connected to one terminal electrode in the second terminal electrode group via the internal electrodes, and capacitance is provided by a pair of the terminal electrodes in the first terminal electrode group via the dielectric layer, and capacitance is provided by a pair of the terminal electrodes in the second terminal electrode group via the dielectric layer. A direction in which the internal electrodes are stacked is parallel or substantially parallel to the two principal surfaces.
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申请公布号 |
US7672112(B2) |
申请公布日期 |
2010.03.02 |
申请号 |
US20090369759 |
申请日期 |
2009.02.12 |
申请人 |
MURATA MANUFACTURING CO., LTD. |
发明人 |
HATTORI KAZUO;FUJIMOTO ISAMU;KUROIWA SHINICHIRO;NODA SATORU |
分类号 |
H01G4/228 |
主分类号 |
H01G4/228 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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