WAFER BAKING DEVICE OF A SEMICONDUCTOR MANUFACTURING EQUIPMENT

摘要

PURPOSE: A wafer baking device of a semiconductor manufacturing apparatus is provided to prevent a defective pattern at end of a wafer in a backing process of a photosensitive pattern by using a chemical sensitizer. CONSTITUTION: A baking device comprises a baking plate(10) and a heating control apparatus(20). The baking plate mounts an object. The baking plate comprises a plurality of heating coils. The heating control apparatus independently controls the heating of a plurality of heating coils. The baking plate comprises a first heating coil(12) and a second heating coil(14).