发明名称 |
Semiconductor package having heat dissipating device with cooling fluid |
摘要 |
A semiconductor package with a heat dissipating device and a fabrication method of the semiconductor package are provided. A chip is mounted on a substrate. The heat dissipating device is mounted on the chip, and includes an accommodating room, and a first opening and a second opening that communicate with the accommodating room. An encapsulant is formed between the heat dissipating device and the substrate to encapsulate the chip. A cutting process is performed to remove a non-electrical part of structure and expose the first and second openings from the encapsulant. A cooling fluid is received in the accommodating room to absorb and dissipate heat produced by the chip. The heat dissipating device covers the encapsulant and the chip to provide a maximum heat transfer area for the semiconductor package.
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申请公布号 |
US7671466(B2) |
申请公布日期 |
2010.03.02 |
申请号 |
US20060647832 |
申请日期 |
2006.12.29 |
申请人 |
SILICONWARE PRECISION INDUSTRIES CO., LTD. |
发明人 |
PU HAN-PING;HUANG CHIEN-PING;HSIAO CHENG-HSU |
分类号 |
H01L23/34;H01L21/00;H05K7/20 |
主分类号 |
H01L23/34 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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