发明名称 |
Epoxy resin composition for encapsulating semiconductor and semiconductor device |
摘要 |
This invention provides an epoxy resin composition for encapsulating a semiconductor exhibiting higher flame resistance, good flowability and adequately higher solder-reflow resistance to allow for the use of a lead-free solder without a flame retardant, as well as a highly reliable semiconductor device in which a semiconductor element is encapsulated with a cured product from the composition.
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申请公布号 |
US7671146(B2) |
申请公布日期 |
2010.03.02 |
申请号 |
US20070713598 |
申请日期 |
2007.03.05 |
申请人 |
SUMITOMO BAKELITE COMPANY, LTD |
发明人 |
UKAWA KEN;KURODA HIROFUMI |
分类号 |
C08G59/14 |
主分类号 |
C08G59/14 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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