| 摘要 |
Probe (40) comprising contact point part (45) electrically connected to an input or output terminal of IC device built in test semiconductor wafer; wiring part (44) provided at its distal end with the contact point part (45); multiple beam parts (42) provided on its superior surface along the longitudinal direction with the wiring part (44); and pedestal part (41) collectively supporting the multiple beam parts (42) in the manner of a cantilever. Each of the beam parts (42) is supported at posterior end region (422) of the beam part (42) by the pedestal part (41), and groove (43A) is provided between adjacent beam parts (42) in the posterior end region (422).
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