| 摘要 |
PURPOSE: A method for manufacturing an LED module is provided to reduce a manufacturing coat and a manufacturing time by performing the molding after mounting an LED chip on a module substrate with a pocket. CONSTITUTION: A module substrate with a pocket and a wiring is prepared(S10). An electrode and the wiring of the LED chip are connected with a bonding wire after mounting the LED chip on the pocket of the module substrate(S20). The LED chip is molded by spraying the fine fluorescent powder to the inside of the pocket mounting an LED chip(S40).
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