RESIN COMPOSITION, RESIN SPACER FILM, AND SEMICONDUCTOR DEVICE

摘要

A resin composition is used as a resin spacer for forming a space between a substrate and a semiconductor element. The resin composition includes an alkali-soluble resin, a photopolymerizing resin, a photopolymerization initiator, and a filler in particle state. The average particle diameter of the filler is 0.05-0.35μm or less, and the content of the filler is 1-40wt%. A resin spacer film is composed of such resin composition.