发明名称 |
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MODULE |
摘要 |
A semiconductor device includes a multilayer wiring substrate having a plurality of inner wiring layers and a semiconductor chip mounted on the multilayer wiring substrate. The multilayer wiring substrate has a groove formed in the bottom surface. The groove does not reach the lowermost of the inner wiring layers.
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申请公布号 |
US2010044880(A1) |
申请公布日期 |
2010.02.25 |
申请号 |
US20090428273 |
申请日期 |
2009.04.22 |
申请人 |
AOKURA ISAMU;YUI TAKASHI;AKAHOSHI TOSHITAKA |
发明人 |
AOKURA ISAMU;YUI TAKASHI;AKAHOSHI TOSHITAKA |
分类号 |
H01L23/48 |
主分类号 |
H01L23/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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