| 摘要 |
This invention provides a copper alloy, for an electronic component, formed of a Cu-Ni-P-base alloy which has good hot workability and, at the same time, can exhibit high strength, high electroconductivity, and high heat conductivity without sacrificing bendability. The copper alloy comprises, by mass, Ni: 0.50% to 1.00% and P: 0.10% to 0.25%. The content ratio of Ni to P is Ni/P = 4.0 to 5.5. The copper alloy further comprises Cr: 0.03% to 0.45% and O: not more than 0.0050%. The content of at least one of Fe, Co, Mn, Ti, and Zr is not more than 0.05%, preferably not more than 0.03%, in total. In the copper alloy, the balance consists of Cu and unavoidable impurities. Regarding the size of Ni-P-base second phase particles, not less than 80% of the area of the total second phase particles contained in the copper alloy is accounted for by second phase particles having an a value of not less than 20 nm and not more than 50 nm and an aspect ratio, a/b, of not less than 1 and not more than 5 wherein a represents a major axis and b represents a minor axis.
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