发明名称 SUBSTRATE PROCESSING APPARATUS
摘要 <P>PROBLEM TO BE SOLVED: To provide a substrate processing apparatus capable of stabilizing electric power supply to respective electrode bodies and improving the uniformity of plasma density among substrates. Ž<P>SOLUTION: The substrate processing apparatus includes: a processing chamber 201 in which substrates are processed; a substrate holder 217 holding a stack of a plurality of substrates 200 in a horizontal posture in the processing chamber 201; an electrode body group including a stack of electrode bodies 301a and 301b arranged at a predetermined distance from surfaces of the respective substrates 200 and generating plasma between adjacent substrates 200 by supplying electric power to the electrode bodies 301a and 301b; an electric power supply mechanism constituted by connecting conductive members 302a and 302b connected to the electrode bodies 301a and 301b in stages in the stacking direction of the substrates 200; and electric power introduction portions 410a and 410b connected to the electric power supply mechanism by penetrating a wall surface of the processing chamber to supply the electric power to the respective electrode bodies through the electric power supply mechanism. The adjacent conductive members 302a and 302b are connected not in a straight line along the stacking direction of the substrates. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
申请公布号 JP2010045225(A) 申请公布日期 2010.02.25
申请号 JP20080208728 申请日期 2008.08.13
申请人 HITACHI KOKUSAI ELECTRIC INC 发明人 ITO TAKESHI;TOYODA KAZUYUKI;SUEYOSHI MAMORU
分类号 H01L21/31;C23C16/458;C23C16/509;H01L21/3065 主分类号 H01L21/31
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