发明名称 |
SEMICONDUCTOR DEVICE HAVING PAIRS OF PADS |
摘要 |
An integrated-circuit semiconductor device includes external electrical connection pads on one face and electrical connection vias under said pads. The electrical connection vias are arranged with a defined pitch in a defined direction. Each via is respectively associated with one of a plurality of adjacent zones of the face. These zones extend perpendicularly to the pitch direction. The electrical connection pads are grouped in adjacent pairs. An insulation space is located between the pads of each pair of electrical connection pads. In a direction perpendicular to the pitch direction, the pads in the pair are spaced apart. The pads of each pair of electrical connection pads extend over a pair of adjacent zones and are associated with two adjacent vias.
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申请公布号 |
US2010044886(A1) |
申请公布日期 |
2010.02.25 |
申请号 |
US20090539542 |
申请日期 |
2009.08.11 |
申请人 |
STMICROELECTRONICS S.A.;STMICROELECTRONICS (CROLLES 2) SAS |
发明人 |
SABOURET ERIC;HOAREAU LAURENT;SALMON YVES |
分类号 |
H01L23/48 |
主分类号 |
H01L23/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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