| 摘要 |
Among other implementations, a method for manufacturing a structure on a substrate is described wherein at least one carrier structure is positioned on a substrate and at least one spacer structure is positioned on the sidewalls of the at least one carrier structure, the at least one carrier structure or the at least one spacer structure is subsequently removed and before or after the removal of the at least one spacer structure or the removal of the at least one carrier structure, an etch resistant layer is positioned in at least one of the following regions: a region not covered by the at least one carrier structure, a region not covered by the at least one spacer structure and a region not covered by the at least one carrier structure and the at least one spacer structure.
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