| 摘要 |
PROBLEM TO BE SOLVED: To provide a die bonder and a bonding method can prevent the occurrence of a void to provide an accurate bonding by removing the impurity causing the occurrence of the void. SOLUTION: The die bonder picks up a chip 22 by a collet at the pickup position to bond the chip 22 held by the collet to a substrate 23 at the bonding position. The chip is passed through an impurity removal atmosphere when transferred from the pickup position to the bonding position. After the removal of the impurity S attached to the chip 22 to cause the occurrence of the void, the bonding is conducted with the state of the impurity S removed by an impurity removal means 35 maintained. COPYRIGHT: (C)2010,JPO&INPIT
|
