发明名称 |
Hochfrequenzvorrichtung |
摘要 |
A high frequency circuit apparatus whose thermal dissipation characteristics is excellent and which is advantageous in the compact design and in the massproductivity is provided. The high frequency circuit apparatus comprises a multilayer substrate 12 in which direct current circuit patterns 16 and 17 for transferring direct current signals are formed on an upper substrate 121 of the multilayer substrate 12 while a high frequency current circuit pattern 18 for transferring high frequency signals is formed on a lower substrate located lower than the upper substrate. <IMAGE> |
申请公布号 |
DE60043636(D1) |
申请公布日期 |
2010.02.25 |
申请号 |
DE2000643636 |
申请日期 |
2000.09.15 |
申请人 |
KABUSHIKI KAISHA TOSHIBA, KAWASAKI |
发明人 |
ISHIDA, MASAAKI;MATSUI, NORIO |
分类号 |
H01L23/12;H01P3/08;H01L25/00;H05K1/00;H05K1/02;H05K1/18;H05K3/00 |
主分类号 |
H01L23/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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