| 摘要 |
A semiconductor device includes a carrier, a chip coupled to the carrier, a dielectric layer coupled to the carrier and the chip, and conducting elements connected to both the carrier and contacts of the chip. The chip includes a first face with a first contact spaced apart from a second contact. The dielectric layer includes a photoinitiator that configures the dielectric layer to be selectively opened to expose the first and second contacts and the carrier. A first conducting element is connected to the first contact, a second conducting element is connected to the second contact, and a third conducting element is connected to the carrier.
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