发明名称 TRANSIENT LIQUID PHASE EUTECTIC BONDING
摘要 A structure including a first structural component, a second structural component and a bonding structure bonding the first and second structural components together, where the bonding structure contains a hypoeutectic solid solution alloy. The hypoeutectic solid solution alloy may be a gold-germanium solid solution alloy, a gold-silicon solid solution alloy or a gold-tin solid solution alloy.
申请公布号 US2010047491(A1) 申请公布日期 2010.02.25
申请号 US20090607456 申请日期 2009.10.28
申请人 ROSEMOUNT AEROSPACE INC. 发明人 ERIKSEN ODD HARALD STEEN;GUO SHUWEN;CHILDRESS KIMIKO J.
分类号 B32B15/04;B32B9/00 主分类号 B32B15/04
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