发明名称 |
PREPREG, PRINTED WIRING BOARD, MULTILAYER CIRCUIT BOARD, AND PROCESS FOR MANUFACTURING PRINTED WIRING BOARD |
摘要 |
The invention relates to a prepreg, obtained by impregnating a base material with an epoxy resin composition containing an epoxy resin(A), a curing agent (B), an accelerator (C), a phenoxy resin (D), and an inorganic filler (E) and semi-hardening the impregnated material, wherein the inorganic filler (E) has an average particle diameter of 3 μm or less. When a circuit with a narrow wire distance is formed on a surface of a insulator substrate composed of such a prepreg by using a method of forming the circuit by plating process, an amount of the plating remaining on the insulator substrate surface at the circuit contour periphery can be reduced. As a result, it leads to stabilization of inter-circuit insulation resistance and increase in a yield during production of printed wiring boards.
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申请公布号 |
US2010044087(A1) |
申请公布日期 |
2010.02.25 |
申请号 |
US20070523775 |
申请日期 |
2007.01.25 |
申请人 |
PANASONIC ELECTRIC WORKS CO., LTD. |
发明人 |
FUKUHARA YASUO;WATANABE TOMOAKI;YAMAGUCHI MAO;KITAI YUKI;FUJIWARA HIROAKI |
分类号 |
H05K1/03;B05D5/12;B32B5/16;B32B9/00;B32B38/00 |
主分类号 |
H05K1/03 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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