| 摘要 |
PROBLEM TO BE SOLVED: To provide an external lead forming mold for a semiconductor device that reliably bends external leads so that the height of respective external lead lower ends are made uniform, and suppress a facility cost increase. SOLUTION: The external lead forming mold has a drag on which the semiconductor device is mounted and a cope having a bending punch for bending the external leads of the semiconductor device, and the cope includes a block which is elevatably arranged over the drag, a cope body having the bending punch, a plurality of rods which are vertically slidable in the cope body, and a rod lock mechanism which restricts elevation of the rods while lower ends of the rods abut against an upper surface of the semiconductor device, wherein the rod lock mechanism has a pin branching substantially in a horizontal direction halfway from each rod and an elevator disposed opposite the tip of the pin and elevated together with the block, the elevator having a slope gradually sloped upward toward the pin side, so that the slope abuts against the tip of the pin when the cope is lowered to restrict the elevation of the rods. COPYRIGHT: (C)2010,JPO&INPIT |
