| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a wiring board and a semiconductor device which reduce warpage and improve the coplanarity, while ensuring flexibility of routing of a wiring pattern formed at the wiring board. Ž<P>SOLUTION: THere are provided a rectangular semiconductor chip containing two or more electrodes, a wiring board 10, in which a semiconductor chip is mounted on one main face, and which includes a wiring pattern for connecting two or more electrodes, contained in the semiconductor chip with two or more external electrodes arranged in a row on the other main face; and a sealing resin 13, accumulated at least on part of one main face of the wiring board 10 for sealing the semiconductor chip. The wiring board 10 includes a slit 16, which reduces the internal stresses of the sealing resin 13, on an extension line of or near the extension line of a diagonal line in the rectangular semiconductor chip. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
|
