发明名称 METHOD OF FABRICATING A HIGH Q FACTOR INTEGRATED CIRCUIT INDUCTOR
摘要 A method of forming an inductor. The method including: (a) forming a dielectric layer on a top surface of a substrate; after (a), (b) forming a lower trench in the dielectric layer; after (b), (c) forming a resist layer on a top surface of the dielectric layer; after (c), (d) forming an upper trench in the resist layer, the upper trench aligned to the lower trench, a bottom of the upper trench open to the lower trench; and after (d), (e) completely filling the lower trench and at least partially filling the upper trench with a conductor in order to form the inductor.
申请公布号 US2010047990(A1) 申请公布日期 2010.02.25
申请号 US20090612743 申请日期 2009.11.05
申请人 INTERNATIONAL BUSINESS MACHINES CORPORATION 发明人 EDELSTEIN DANIEL C.;ANDRICACOS PANAYOTIS C.;COTTE JOHN M.;DELIGIANNI HARIKLIA;MAGERLEIN JOHN H.;PETRARCA KEVIN S.;STEIN KENNETH J.;VOLANT RICHARD P.
分类号 H01F41/04;H01L21/02;H01F17/00;H01L23/485;H01L23/522;H01L23/532;H01L27/08 主分类号 H01F41/04
代理机构 代理人
主权项
地址