| 摘要 |
The arrangement (1) has a semiconductor chip (2), and a mold (3) covering the semiconductor chip, where the mold includes an array of recesses in a surface (11) of the mold. A set of flexible elements is arranged in the recesses, where the flexible elements connect a set of contact elements e.g. solder bump (12), including coated polymer balls with the mold. Another set of contact elements is rigidly connected with the semiconductor chip, where the former contact elements and the latter contact elements define a common plane for assembly of the arrangement at a carrier. An independent claim is also included for a method for manufacturing an electronic arrangement. |
