| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method of a wiring substrate of favorable handling characteristic wherein a wire is used for wiring in the middle of wiring connecting electrically a mounting pad where a semiconductor element is mounted to a pad for an external connection terminal. SOLUTION: A through-hole 14 is formed at a part where wire wiring 32 is used on a substrate 10 where internal wiring 12 for electrically connecting a mounting pad 22 to an external connection pad is formed except for a part where the wire wiring 32 is used. Then, bonding pads 30 and 30 are formed at the end of a surface wiring pattern 24 which is electrically connected to the mounting pad 22 formed on the same plane as the substrate 10 to face the through-hole 14, and at the end of a surface wiring pattern 26 connected electrically to the external connection pad through the internal wiring 12. Then, the bonding pads 30 and 30 are electrically connected to each other by the wire wiring 32 so that a top does not protrude from the through-hole 14, and after that, the through-hole 14 is sealed with a sealing resin 34. COPYRIGHT: (C)2010,JPO&INPIT |
