| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a substrate for a bottom cover tape which is excellent in adhesiveness with a carrier tape and has no ooze out of a resin. Ž<P>SOLUTION: The substrate for the chip carrier bottom cover tape is a single-sided thin gloss paper consisting of a broadleaf pulp, having a tensile strength in the vertical direction of ≥1.3 KN/m (JIS P 8113:2006), and having an air permeability of 20-80 seconds(Japan Tappi No.5-2:2000). A method for manufacturing the substrate for the chip carrier bottom cover tape is characterized in that the paper is manufactured by using a broadleaf pulp 100% whose freeness is adjusted in a range of 50-350 mlCSF as the raw material pulp, and after it is dried by a Yankee drier, it is processed by a soft calender, and the smoothness of the contact face of the Yankee drier is made to be ≥500 seconds(JIS P 8119:1998). Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
|
