发明名称 TREATMENT DEVICE, METHOD FOR FORMING FILM AND HEAT TREATMENT METHOD
摘要 PROBLEM TO BE SOLVED: To provide a treatment device which suppresses the phenomenon that, upon the unload of a board, radiant heat from a heated wafer heats the vicinity of the seal part in the outer tube of an inlet flange and by-products such as NH<SB>4</SB>Cl stuck thereto evaporate, and reduces contamination and particles in the tube. SOLUTION: The treatment device incldues: an outer tube made of quartz; an inlet flange containing a gas exhaust port provided at the lower edge of the outer tube made of quartz via a seal part; a tube receiver provided at the inner wall of the inlet flange; an inner tube made of quartz provided at the tube receiver at the inside of the outer tube made of quartz concentrically with the outer tube made of quartz and loaded with a board having a wafer thereon; and a tube provided from the tube receiver to the vicinity of the seal part of the outer tube made of quartz concentrically with the inner tube made of quartz and having a heat ray permeability lower than that of the inner tube made of quartz. COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2010043362(A) 申请公布日期 2010.02.25
申请号 JP20090265984 申请日期 2009.11.24
申请人 HITACHI KOKUSAI ELECTRIC INC 发明人 MINAMI MASAKATSU
分类号 C23C16/44;H01L21/31 主分类号 C23C16/44
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