IN-LINE DIE CLEANING DEVICE AND CLEANING METHOD EMPLOYING PLASMA

摘要

Disclosed is an in-line die cleaning device for plasma cleaning, in an in-line fashion, at least one of the upper die and the lower die provided in a semiconductor moulding apparatus. The disclosed in-line die cleaning device comprises: a cleaning module which is constituted in such a way as to form a chamber when mated with at least one of the upper die and the lower die, and to generate plasma within the chamber; and a conveyor unit for conveying the cleaning module from a starting position to a cleaning standby position between the upper die and the lower die, wherein in the cleaning standby position, the cleaning module is raised by means of the lower die and is mated with the upper die.