发明名称 MULTILAYER CHIP CAPACITOR AND CIRCUIT BOARD APPARATUS HAVING THE SAME
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a multilayer chip capacitor that has both low ESL and high ESR characteristics without changing materials, and easily embodies flat impedance characteristics over a frequency range of a wide band. <P>SOLUTION: The multilayer chip capacitor includes: a capacitor body including first and second capacitor units disposed in a laminated direction; first to fourth outer electrodes formed on side surfaces of the capacitor body; and at least one connecting conductor line connecting the first and the third outer electrodes having identical polarity to each other or the second and the fourth outer electrodes having identical polarity to each other. The first capacitor body includes first and second inner electrodes, and the second capacitor unit includes a plurality of third and fourth inner electrodes. The first to the fourth outer electrodes are connected to the first to the fourth inner electrodes, respectively. An equivalent series resistance (R1) of the first capacitor unit and a combined equivalent series resistance (R2') of the second capacitor and the connecting conductor line satisfy 0.7(R1)≤R2'≤1.3(R1). <P>COPYRIGHT: (C)2010,JPO&INPIT</p>
申请公布号 JP2010045323(A) 申请公布日期 2010.02.25
申请号 JP20080283774 申请日期 2008.11.04
申请人 SAMSUNG ELECTRO-MECHANICS CO LTD 发明人 LEE BYOUNG HWA;WI SUNG KWON;CHUNG HAE SUK;PARK DONG SEOK;PARK SANG SOO;PARK MIN CHEOL
分类号 H01G4/30;H01G2/06;H01G4/12;H05K3/46 主分类号 H01G4/30
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