发明名称 ELECTROMAGNETIC RELAY
摘要 <p><P>PROBLEM TO BE SOLVED: To reduce thermal stress applied on external terminals for surface mounting in an electromagnetic relay, and improve reliability of mounting and reliability of the device on which the electromagnetic relay is mounted. <P>SOLUTION: The electromagnetic relay 1 has a plurality of external terminals which are formed protruded from a case 5 to constitute the body. As the external terminals, a plurality of surface mounting terminals 11-18 are provided whose top end portions are formed so as to be located on a common plane. Furthermore, through-hole terminals 21-22 are provided whose top end portions extend protruded from the case 5 further than the common plane on which the top end portions of the surface mounting terminals 11-18 are located. <P>COPYRIGHT: (C)2010,JPO&INPIT</p>
申请公布号 JP2010044974(A) 申请公布日期 2010.02.25
申请号 JP20080209267 申请日期 2008.08.15
申请人 FUJITSU COMPONENT LTD 发明人 YOKOYAMA KENICHI;AOKI SHIGEMITSU
分类号 H01H50/04;H01H50/14 主分类号 H01H50/04
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