发明名称 |
VERFAHREN ZUM ELEKTRISCHEN VERBINDEN EINES HALBLEITERCHIPS MIT ZUMINDEST EINER KONTAKTFLÄCHE |
摘要 |
<p>The invention concerns a method of electrically connecting a semiconductor chip (1) to at least one contact surface by means of a thin wire whose first end is welded to the at least one contact surface and whose second end is connected to a contact area of the semiconductor chip (1). In order to establish a good connection between the wire and the contact area of the semiconductor chip (1), the second end of the wire is welded to a wedge-shaped metal part (5) which is disposed on the contact area of the semiconductor chip (1) and is conductively connected thereto. The metal part (5) is formed by a nailhead contact (6) whose free end is guided in a loop and connected to the nailhead by a wedge contact.</p> |
申请公布号 |
DE59611504(D1) |
申请公布日期 |
2010.02.25 |
申请号 |
DE1996511504 |
申请日期 |
1996.09.19 |
申请人 |
INFINEON TECHNOLOGIES AG |
发明人 |
HEITZER, JOSEF;KIRSCHBAUER, JOSEF;STAMPKA, PETER |
分类号 |
H01L21/60;H01L21/607;B23K20/00 |
主分类号 |
H01L21/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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