PRODUCT CHIPS AND DIE WITH A FEATURE PATTERN THAT CONTAINS INFORMATION RELATING TO THE PRODUCT CHIP, METHODS FOR FABRICATING SUCH PRODUCT CHIPS AND DIE, AND METHODS FOR READING A FEATURE PATTERN FROM A PACKAGED DIE

摘要

Product chips and die, methods for fabricating product chips, and methods for tracking the identity of die after singulation from a wafer. The product chips and die include a pattern of features (85) formed in a metallization level of a back-end-of-line (BEOL) wiring structure. The features (80-84) in the pattern contain information relating to the die, such as a unique identifier that includes a wafer identification for a wafer used to fabricate the die and a product chip location for the die on the wafer. The features may be imaged with the assistance of a beam of electromagnetic radiation that penetrates into a packaged die and is altered by the presence of the features in a way that promotes imaging.