| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an electronic part module having high airtightness, and a method for manufacturing the same. <P>SOLUTION: This electronic part module has an insulating substrate 2, a device chip 10 for mounting a flip chip on an upper surface of the insulating substrate 2, a chip 14 connected to the insulating substrate 2, a lid 16 arranged in an upper part of the insulating substrate 2 and the device chip 10, a first metallic pattern 22 arranged in a peripheral part of an upper surface of the insulating substrate 2 so as to surround the upper surface of the insulating substrate 2, a second metallic pattern 24 arranged in a peripheral part of a surface opposed to the insulating substrate 2 of the lid 16 so as to surround the surface opposed to the insulating substrate 2 of the lid 16, and sealing solder 20 for joining the first metallic pattern 22 and the second metallic pattern 24 so that a cavity 28 is formed in an area not having the first metallic pattern 22 and the second metallic pattern 24 between the insulating substrate 2 and the lid 16, and between the insulating substrate 2 and the device chip 10. <P>COPYRIGHT: (C)2010,JPO&INPIT |
