发明名称 METHODS AND APPARATUS FOR POLISHING A SEMICONDUCTOR WAFER
摘要 Methods and apparatus provide for: a base on which a substrate may be releasably coupled; a moving belt located with respect to the base such that a contact surface thereof is operable to remove material from a top surface of the substrate; and a plurality of actuators, at least two of which are independently controllable, located with respect to the base and the moving belt such that a corresponding plurality of pressure zones are defined to provide pressure between the moving belt and the top surface of the substrate.
申请公布号 KR20100021636(A) 申请公布日期 2010.02.25
申请号 KR20097027366 申请日期 2008.05.27
申请人 CORNING INCORPORATED 发明人 EISENSTOCK GREGORY;THOMAS JOHN C.
分类号 B24B37/04;H01L21/304 主分类号 B24B37/04
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