发明名称 METHOD OF FORMING PATTERN AND METHOD OF PRODUCING ELECTRONIC ELEMENT
摘要 A method of forming a pattern and a method of producing an electronic element with which a fine and precise pattern is stably formed are provided. Each of the method of forming a pattern and the method of producing an electronic element includes a step of forming an electrically conductive film D by applying a liquid composition onto a first plate 10; a step of forming an electrically conductive pattern D′ on the first plate 10 by pressing a second plate 20 onto a surface side of the first plate 10, on which the electrically conductive film D is formed, to transfer an unwanted pattern of the electrically conductive film D to top faces of projections 20a of the second plate 20, thereby removing the unwanted pattern; and a step of transferring the electrically conductive pattern D′ by pressing the surface side of the first plate 10, on which the electrically conductive pattern D′ is formed, onto a surface of a transfer-receiving substrate, wherein when a surface tension of the surface of the first plate 10, onto which the liquid composition is applied, is represented by α, a dynamic surface tension of the liquid composition at 100 msec measured by a maximum bubble pressure method is represented by &bgr;, and a surface tension of the top faces of the projections 20a of the second plate 20 is represented by γ, the composition of the liquid composition or a material of the surface of the first plate 10 or the second plate 20 is set so as to satisfy γ>α≧&bgr;.
申请公布号 US2010044905(A1) 申请公布日期 2010.02.25
申请号 US20080593846 申请日期 2008.01.10
申请人 SONY CORPORATION 发明人 FUKUDA TOSHIO;NOMOTO AKIHIRO
分类号 B28B3/00 主分类号 B28B3/00
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