| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a resist composition that forms a resist pattern improved in the collapse of the resist pattern, line edge roughness and the generation of scum, less liable to the deterioration of the profile, and having good conformability to an immersion liquid in immersion exposure; and to provide a pattern forming method using the resist composition. <P>SOLUTION: The positive resist composition comprises (A) a resin that, when acted on by an acid, exhibits an increased solubility in an alkali developer, (B) a compound that, when exposed to actinic rays or radiation, generates an acid, (C) a resin containing two or more resins (c) each having at least either a fluorine atom or a silicon atom, and (D) a solvent. <P>COPYRIGHT: (C)2010,JPO&INPIT |
