发明名称 SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS
摘要 PROBLEM TO BE SOLVED: To efficiently dry a substrate while suppressing a used amount of a drying fluid such as IPA. SOLUTION: In a drying process after a pure water rinsing process, the drying fluid and inert gas are supplied to the substrate while rotating the substrate with pure water adhered thereto. At this time, a fluid nozzle 12 and an inert gas nozzle 13 are moved radially outward with respect to the rotational center of the substrate while maintaining a supply position of the inert gas to the substrate closer to the rotational center of the substrate Po than a supply position of the drying fluid. In starting the drying process, firstly the fluid nozzle and inert gas nozzle start to move with the inert gas nozzle positioned at a front side from the rotational center of the substrate, and the supply of the drying fluid is started. Then, the supply of the inert gas is started when the inert gas nozzle reaches the rotational center of the substrate. COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2010045389(A) 申请公布日期 2010.02.25
申请号 JP20090254293 申请日期 2009.11.05
申请人 TOKYO ELECTRON LTD 发明人 ORII TAKEHIKO;SEKIGUCHI KENJI;UCHIDA NORIOMI;TANAKA AKIRA;ONO HIROMOTO
分类号 H01L21/304;H01L21/027;H01L21/306 主分类号 H01L21/304
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