CIRCUIT FOR DETECTING BONDING DEFECT IN MULTI-BONDING WIRE

摘要

An integrated circuit for detecting a bonding defect in a multi-bonding wire. The integrated circuit includes a plurality of pads each connectable by a bonding wire to a lead terminal. Voltage supplied to the lead terminal is applied in common to the plurality of pads. A detection circuit is operably connected to the plurality of pads. The detection circuit detects breakage of the bonding wires based on potentials at the plurality of pads.