摘要 |
<p>One embodiment of the present invention provides a method for fabricating an InGaAlN light-emitting semiconductor structure. During the fabrication process, at least one single-crystal sacrificial layer is deposited on the surface of a base substrate to form a combined substrate, wherein the single-crystal sacrificial layer is lattice-matched with InGaAlN, and wherein the single crystal layer forms a sacrificial layer. Next, the InGaAlN light-emitting semiconductor structure is fabricated on the combined substrate. The InGaAlN structure fabricated on the combined substrate is then transferred to a support substrate, thereby facilitating a vertical electrode configuration. Transferring the InGaAlN structure involves etching the single-crystal sacrificial layer with a chemical etchant. Furthermore, the InGaAlN and the base substrate are resistant to the chemical etchant. The base substrate can be reused after the InGaAlN structure is transferred.</p> |
申请人 |
LATTICE POWER (JIANGXI) CORPORATION;XIONG, CHUANBING;JIANG, FENGYI;WANG, LI;ZHANG, SHAOHUA;WANG, GUPING;WANG, GUANGXU |
发明人 |
XIONG, CHUANBING;JIANG, FENGYI;WANG, LI;ZHANG, SHAOHUA;WANG, GUPING;WANG, GUANGXU |