| 摘要 |
<P>PROBLEM TO BE SOLVED: To improve productivity and quality by preventing foreign matters on the rear face of a wafer from being coagulated owing to drying of the rear face during polishing. <P>SOLUTION: In this device, a plurality of air injection holes 19 are provided in a back plate 8 arranged in a polishing head for polishing the wafer W, a pressure air layer is formed between the back plate 8 and the rear face of the wafer W by injecting air from the plurality of air injection holes 19, pressing force from a pressing means 16 transmitted to the back plate 8 is transmitted to the wafer W via the pressure air layer, and thereby a surface of the wafer W is polished by pressing the surface on a polishing pad 6. In the device, the polishing is performed, while preventing drying of the rear face of the wafer W by incorporating pure water by a prescribed ratio into the air injected from the air injection holes 19 and bringing a part of the air containing the pure water into direct contact with the rear face of the wafer W. <P>COPYRIGHT: (C)2010,JPO&INPIT |
