发明名称 DOPED SUBSTRATE TO BE HEATED
摘要 A semiconductor structure that is to be heated. The structure includes a substrate for the front face deposition of a useful layer intended to receive components for electronics, optics or optoelectronics. The structure contains doped elements that absorb infrared radiation so as to substantially increase infrared absorption by the structure so that the front face reaches a given temperature when a given infrared power is supplied to the structure. At least one part of the doped elements have insufficient electrical activity or localization in the structure, such that they cannot disturb the operation of the components. In addition, a method of producing this structure and a method of forming a useful layer of semiconductor material on the structure.
申请公布号 US2010044705(A1) 申请公布日期 2010.02.25
申请号 US20080530606 申请日期 2008.03.25
申请人 LANGER ROBERT;LAHRECHE HACENE 发明人 LANGER ROBERT;LAHRECHE HACENE
分类号 H01L29/04;H01L21/20 主分类号 H01L29/04
代理机构 代理人
主权项
地址