CARRIER FOR DUAL-SURFACE POLISHING DEVICE, AND DUAL-SURFACE POLISHING DEVICE AND DUAL-SURFACE POLISHING METHOD USING THE SAME

摘要

Disclosed is a carrier for a dual-surface polishing device that is equipped at least with a carrier main body that is placed between upper and lower fixed plates to which a polishing cloth is attached and in which is formed a retaining hole that retains a wafer that is sandwiched between the aforementioned upper and lower surface plates during polishing, and with a ring-shaped resin ring that is placed around the inner circumference of the retaining hole of said carrier, making contact with a chamfered portion of the aforementioned retained wafer and protecting said chamfered portion. The inner circumference of the aforementioned resin ring has a concave groove, and the aforementioned wafer is retained by upper and lower tapered surfaces formed in said concave groove touching the chamfered portion of the wafer in cross-sectional point contact. Thus it is possible to provide a carrier for a dual-surface polishing device, as well as a dual-surface polishing device and a dual-surface polishing method using the same, which can prevent sagging at the outer perimeter of the wafer due to creep deformation of the polishing cloth and which can reduce tapering of the polished surface and improve flatness by rotating the wafer during polishing.