发明名称 |
ANTENNA MODULE, DEVICE FOR MANUFACTURING ANTENNA MODULE, NON-CONTACT IC CARD AND DEVICE FOR MANUFACTURING NON-CONTACT IC CARD |
摘要 |
<p><P>PROBLEM TO BE SOLVED: To promote heat radiation in an IC chip, and to suppress displacement of a reinforcement board on both sides of an insulating substrate. <P>SOLUTION: An IC chip is mounted on the mounting surface of an insulating substrate 21. A reinforcement plate for protecting the IC chip is installed on the mounting surface side and a non-mounting surface 21B side. A pattern 23 is formed at a position corresponding to the IC chip on the non-mounting surface 21B of the insulating substrate 21. The pattern 23 is provided with light transmission parts 41-1 to 41-4 so that end sections 42-1 to 42-4 of the reinforcement plate 24 at the mounting surface side can be positioned inside. This invention may be applied to, for example, the non-contact IC card. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
申请公布号 |
JP2010044604(A) |
申请公布日期 |
2010.02.25 |
申请号 |
JP20080208372 |
申请日期 |
2008.08.13 |
申请人 |
SONY CORP |
发明人 |
SHIBAMOTO GORO;AIZAWA TAKANORI;HAYANO TAKESHI |
分类号 |
G06K19/077;G06K19/07;H01Q1/38;H05K1/02 |
主分类号 |
G06K19/077 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|