发明名称 ANTENNA MODULE, DEVICE FOR MANUFACTURING ANTENNA MODULE, NON-CONTACT IC CARD AND DEVICE FOR MANUFACTURING NON-CONTACT IC CARD
摘要 <p><P>PROBLEM TO BE SOLVED: To promote heat radiation in an IC chip, and to suppress displacement of a reinforcement board on both sides of an insulating substrate. <P>SOLUTION: An IC chip is mounted on the mounting surface of an insulating substrate 21. A reinforcement plate for protecting the IC chip is installed on the mounting surface side and a non-mounting surface 21B side. A pattern 23 is formed at a position corresponding to the IC chip on the non-mounting surface 21B of the insulating substrate 21. The pattern 23 is provided with light transmission parts 41-1 to 41-4 so that end sections 42-1 to 42-4 of the reinforcement plate 24 at the mounting surface side can be positioned inside. This invention may be applied to, for example, the non-contact IC card. <P>COPYRIGHT: (C)2010,JPO&INPIT</p>
申请公布号 JP2010044604(A) 申请公布日期 2010.02.25
申请号 JP20080208372 申请日期 2008.08.13
申请人 SONY CORP 发明人 SHIBAMOTO GORO;AIZAWA TAKANORI;HAYANO TAKESHI
分类号 G06K19/077;G06K19/07;H01Q1/38;H05K1/02 主分类号 G06K19/077
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