| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a retainer ring for CMP equipment, which can continue to properly polish a to-be-polished surface of a wafer even if a side face on the outer periphery side of the retainer ring is brought into contact with other member. <P>SOLUTION: On a side face 8f on the outer periphery side of a retainer ring, an amorphous hard carbon film 81 is formed. Since the hard carbon film 81 has a high hardness, a high wear resistance, and a low friction coefficient, and is smooth and has a high lubricant property, even if the side face 8f is brought into contact with other member and is repeatedly done so, the side face 8f does not wear and suffer a loss, deformation, etc. Consequently, a uniform contact between a pressing surface 8a of the retainer ring 8 and a polishing surface 3a of a polishing pad 3 is maintained, making it possible for the retainer ring to continue to properly polish a to-be-polished surface W1 of a wafer W. <P>COPYRIGHT: (C)2010,JPO&INPIT |
