发明名称 |
Manufacturing method of printed wiring board as well as copper-clad laminate and treatment solutions used therefor |
摘要 |
There is provided a method for removing molten and scattered Cu and overhang that are generated around a via opening during laser machining in a direct laser via forming method of directly machining an outer-layer copper foil. In a manufacturing method of a printed wiring board of machining the via by laser directly through the copper foil of a copper-clad laminate in which the copper foil is clad on a base material resin, a process for machining the via is carried out in a sequence of (a) a copper foil surface treatment step of forming an oxide film on the surface of said copper foil, (b) a laser via machining step, (c) an alkali treatment step and (d) a molten and scattered Cu etching step. It is desirable to carry out (e) a de-smearing treatment after the molten and scattered Cu etching. |
申请公布号 |
US7666320(B2) |
申请公布日期 |
2010.02.23 |
申请号 |
US20060443013 |
申请日期 |
2006.05.31 |
申请人 |
HITACHI VIA MECHANICS, LTD. |
发明人 |
KAWAMURA TOSHINORI;AKAHOSHI HARUO;ARAI KUNIO |
分类号 |
B23K26/00;H05K3/00 |
主分类号 |
B23K26/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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