| 摘要 |
PURPOSE: A semiconductor package and a method of fabricating the same are provided to secure the reliability of a back - grinding process by preventing the bending of a wafer. CONSTITUTION: A semiconductor package(100) comprises a semiconductor chip(102), a first solder mask(108), a second conductive pattern(112), and a second solder mask(114). The semiconductor chip comprises the bonding pad(104) and the first conductive pattern(110). The first conductive pattern is connected to the top side of the semiconductor chip and the bonding pad. A first solder mask comprises a first opening which exposes a part of the first conductive pattern. The second conductive pattern is arranged in a lower-part of the semiconductor chip and is electrically connected to the first conductive pattern. The second solder mask comprises the second opening which exposes a part of the second conductive pattern.
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