发明名称 |
System, apparatus and method of selective laser repair for metal bumps of semiconductor device stack |
摘要 |
Exemplary embodiments of the selective laser repair apparatus and method may allow the repair of metal bumps in a semiconductor device stack by applying a laser beam to a damaged and/or defective bump. Metal bumps may be repaired and individual chips and/or packages forming a device stack need not be separated. The operation of a control unit and a driving unit may position a laser unit such that a laser beam may be irradiated at the damaged and/or defective metal bump. An X-ray inspection unit may obtain information about the damaged and/or defective metal bump.
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申请公布号 |
US7666690(B2) |
申请公布日期 |
2010.02.23 |
申请号 |
US20080222648 |
申请日期 |
2008.08.13 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
LEE KANG-WOOK;JEONG SE-YOUNG |
分类号 |
H01L21/00;H01L23/50;B23K26/00;H01L21/48 |
主分类号 |
H01L21/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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